TSMC’s 2nm process (N2) is one of the most advanced semiconductor nodes globally. Credit: TSMC
At TSMC’s 2025 Europe Technology Symposium, Paul de Bot, General Manager of the European Semiconductor Manufacturing Company (ESMC), announced that TSMC’s Munich Design Centre will be launched in the third quarter. The Munich Design Centre is intended to support chip design customers served by the ESMC fab. “This is to help European customers design high-density, high-performance, and energy-efficient chips, with a continued focus on automotive, industrial, artificial intelligence (AI), and IoT applications,” said Paul de Bot. In August 2023, TSMC announced a joint investment with three European semiconductor companies, Bosch, Infineon and NXP, to establish the ESMC in Dresden, Germany. [Icsmart, in Chinese]
