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Bottom line: Intel and TSMC are both gearing up to launch their respective 18A and N2 process nodes, each offering significant advancements. On one side, Intel claims 18A will deliver much higher generational performance gains. On the other, TSMC is emphasizing N2’s impressive transistor density. But which one is truly superior? As it turns out, the answer isn’t so straightforward.
A new report from TechInsights breaks things down, suggesting we could be in for a closely matched competition.
When it comes to transistor density, TSMC’s N2 appears to take the lead. The publication’s data estimates N2’s high-density standard cell transistor density at an impressive 313 million transistors per square millimeter, outpacing Intel’s 18A at 238 million and Samsung’s SF3 at 231 million. Of course, density isn’t everything; chip designers use a mix of high-, standard-, and low-power cells. However, TSMC’s advantage in density could provide an edge for certain workloads.
The comparison becomes less clear when it comes to performance projections. Intel’s 18A may have an advantage over TSMC’s N2 and Samsung’s SF3, but these are still just estimates based on extrapolating from previous node improvements.
What we do know is that Intel is equipping 18A with its new PowerVia backside power delivery technology to enhance speed and efficiency. While TSMC has plans for a similar approach in the future, N2 won’t include it. However, it’s worth noting that not every 18A chip will feature this technology.
When it comes to efficiency, analysts expect N2 chips to outperform 18A and Samsung’s offerings. TSMC has consistently led in power efficiency, so this projection aligns with recent trends.
Another key differentiator is production timelines. Intel remains ahead, with 18A set to enter high-volume manufacturing for next-gen Core Ultra processors by mid-2025. These chips are expected to hit shelves before the end of the year. Meanwhile, TSMC’s N2 volume production won’t begin until late 2025, meaning the first N2-based products likely won’t arrive until mid-2026 at the earliest, following standard industry timelines.
In summary, TSMC holds the transistor density lead with N2, but Intel’s 18A could take the performance crown thanks to architectural advancements and innovations like PowerVia. Additionally, Intel’s head start in production means 18A silicon will be available in real-world products much sooner.
